|
| Nguồn gốc | Hoa Kỳ |
| Hàng hiệu | GE |
| Chứng nhận | CO.CQ |
| Số mô hình | 531X124MSDAJG2 |
Product Specification
| Brand/Manufacturer | GE/USA |
| Part Number | 531X124MSDAJG2 |
| Alternate Part Number | 531X124MSDAJG2 |
| Description | MFC Suppression Board |
| Dimennsions | 2.7*27.8*20.7cm |
| Weight | 0.36kg |
Product Details
In general, the aluminum PLC baseplate is used for module shield grounding.
On many Series 90-30 I/O modules, shield connections to the removable
terminal block on the module are routed to the baseplate through the module’ s
backplane connector. Other modules, such as CPUs 351, 352, 363, and 364,
require a separate shield ground. These modules come equipped with suitable
grounding hardware. Grounding instructions for these CPUs are discussed in
the Series 90–30 Installation and Har dware Manual, GFK–0356P (or later
version). Some of the Series 90-30 Option modules, such as the FIP Remote
I/O Scanner , and DSM modules ( also have shield grounding requirements.
These modules come equipped with suitable grounding hardware. Please refer
to each module’ s user’s manual for grounding instructions.
GE News
GE Healthcare Takes Additional Actions to Help Clinicians Combat
Coronavirus:
CHICAGO – March 24, 2020 – GE Healthcare today provided two updates
on its continued efforts to support clinicians, governments and the broader
healthcare community in the fight against the coronavirus (COVID-19).
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